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Specifications

Important

Unless otherwise stated, all specifications apply after 30 minutes of instrument warm-up.

Important

Important changes in the specification parameters are explicitly mentioned in the revision history of this document.

General Specifications

Table 1: General and storage
Parameter Min Typ Max
storage temperature –25 °C - 65 °C
storage relative humidity (non-condensing) - - 95%
operating temperature 5 °C - 40 °C
operating relative humidity (non-condensing) - - 90%
specification temperature 18 °C - 28 °C
power consumption - - 300 W
operating environment IEC61010, indoor location, installation category II, pollution degree 2    
operating altitude up to 2000 meters    
power inlet fuses 250 V, 2 A, fast acting, 5 x 20 mm    
power supply AC line 100-240 V (±10%), 50/60 Hz    
dimensions (width x depth x height) 45.0 × 39.7 × 13.2 cm (no handle), 17.7 × 15.6 × 5.2 inch, 19 inch rack compatible    
weight 15 kg (33 lb)    
recommended calibration interval 2 years    
Table 2: Maximum ratings
Parameter Min Typ Max
damage threshold Signal Out -10 V - +10 V
damage threshold Signal In -3 V - +3 V
damage threshold Trig Out –0.7 V - +4 V
damage threshold Ref/Trig In (1 kΩ input impedance) –11 V - +11 V
damage threshold Ref/Trig In (50 Ω input impedance) –6 V - +6 V
damage threshold Aux In (DC) -10 V - +10 V
damage threshold Aux In (AC) -3 V - +3 V
damage threshold External Clk In (DC) –3 V - +3 V
damage threshold External Clk In (AC, with DC offset 0 V) -1.5 V - +1.5 V
damage threshold External Clk Out (DC) –3 V - +3 V
MDS In / Out –0.7 V - +4 V
DIO In / Out in default configuration 3.3 V CMOS/TTL –0.7 V - +4 V
torque limit front panel SMA connectors - - 0.5 Nm
torque limit back panel SMA connectors - - 1.0 Nm
Table 3: Host computer requirements
Parameter Description
supported Windows operating systems Windows 10, 11 on x86-64
supported macOS operating systems macOS 10.11+ on x86-64 and ARMv8
supported Linux distributions GNU/Linux (Ubuntu 14.04+, CentOS 7+, Debian 8+) on x86-64 and ARMv8
supported processors x86-64 (Intel, AMD), ARMv8 (e.g., Raspberry Pi 4 and newer, Apple M-series)

Analog Interface Specifications

Table 4: Signal Outputs
Parameter Details Min Typ Max
connectors - SMA, front panel single-ended
impedance - - 50 Ω -
coupling Baseband AC/DC
RF AC
D/A converter vertical resolution - 14 bit
D/A converter sampling rate after internal x3 interpolation 6 GSa/s
measurement band RF (measurement band around the selected center frequency) ±500 MHz
Baseband 800 MHz
total frequency range DC - 8.5 GHz
power range (into 50Ω) Baseband -30 dBm - +5 dBm
RF -30 dBm - +10 dBm
amplitude range (into 50Ω) Baseband 10 mVpk - 0.5 Vpk
RF 10 mVpk - 1 Vpk
frequency resolution - 7 µHz
voltage spectral noise density Baseband, 300 mVpk range, into 50 Ω 100 MHz - 8.6 nV/√Hz -
RF, 1 Vpk range, into 50 Ω, center freq offset > 200 kHz 1 GHz - 40 nV/√Hz -
4 GHz - 23 nV/√Hz -
6 GHz - 14 nV/√Hz -
8 GHz - 14 nV/√Hz -
Table 5: Signal Inputs
Parameter Details Min Typ Max
connectors - SMA, front panel single-ended
impedance - - 50 Ω -
coupling Baseband AC/DC
RF AC
A/D converter vertical resolution - 14 bit
A/D converter sampling rate before internal x2 decimation 4 GSa/s
measurement band RF (measurement band around the selected center frequency) ±500 MHz
Baseband 800 MHz
total frequency range DC - 8.5 GHz
power range (into 50 Ω) Baseband -30 dBm - +10 dBm
RF -50 dBm - +10 dBm
amplitude range (into 50 Ω) Baseband 10 mVpk - 1 Vpk
RF 1 mVpk - 1 Vpk
offset amplitude Baseband - 5% -
voltage spectral noise density Baseband, 100 kHz - 800 MHz, 10 mV range - ≤3.5 nV/√Hz -
RF, > 800 MHz, 10 mV range - ≤2.5 nV/√Hz -
spurious free dynamic range (excluding harmonics) signal at center frequency, max. amplitude, -500 to 500 MHz 10 dBm - 52 dBc -
0 dBm - 52 dBc -
-10 dBm - 52 dBc -
-20 dBm - 47 dBc -
-30 dBm - 52 dBc -
-40 dBm - 52 dBc -
-45 dBm - 47 dBc -
-50 dBm - 42 dBc -
3rd order intermodulation distortion dual tone with -7 dBFS of range with 150 MHz Splitting from 1 GHz to 8 GHz 10 dBm - 45 dBc -
0 dBm - 54 dBc -
-10 dBm - 54 dBc -
-20 dBm - 56 dBc -
-30 dBm - 54 dBc -
-40 dBm - 50 dBc -
-50 dBm - 40 dBc -
Table 6: Demodulators
Parameter Details Min Typ Max
number of demodulators - 8
demodulator harmonic setting range - 1 - 1023
demodulator filter time constant - 14 ns - 21 s
demodulator filter bandwidth - 3.2 mHz - 11 MHz (with filter bypass)
demodulator filter slope/roll-off - 6, 12, 18, 24 dB, consisting of 4 cascaded filters
data transfer > 1 Gbit/s undisturbed connection to the host computer Continuous - - 2 MSa/s
Triggered - - 50 MSa/s
Table 7: Auxiliary outputs and inputs
Parameter Details min typ max
high-speed auxiliary output connectors BNC, 4 outputs on front panel    
  sampling 50 MSa/s, 14 bit    
  bandwidth (3 dB) 15 MHz    
  impedance 50 Ω    
  amplitude (into 50 Ω) -4 V - +4 V
high-precision auxiliary output connectors BNC, 4 outputs on front panel    
  sampling 1 MSa/s, 18 bit    
  bandwidth (3 dB) 200 kHz    
  impedance 50 Ω    
  amplitude (into 50 Ω) -4 V - +4 V
Table 8: Trigger Outputs & Inputs
Parameter Details Min Typ Max
trigger outputs - 2 per channel, SMA output on front panel    
trigger output high voltage - - 3.3 V -
trigger output low voltage - - 0 V -
trigger output impedance - - 50 Ω -
trigger output rise time 20% to 80% - - 300 ps -
trigger output period jitter square wave, 100 MHz - 60 ps p-p -
trigger inputs - 2 per channel, 2 SMA on front panel    
trigger input impedance - 50 Ω / 1 kΩ    
trigger input voltage range 50 Ω impedance –5 V - 5 V
  1 kΩ impedance –10 V - 10 V
trigger input threshold range 50 Ω impedance –5 V - 5 V
  1 kΩ impedance –10 V - 10 V
trigger input threshold resolution - - < 0.4 mV -
trigger input threshold hysteresis - - > 60 mV -
trigger input min. pulse width - - 5 ns -
trigger input max. operating frequency - - 300 MHz -
Table 9: Other Inputs and Outputs
Parameter Details min Typ Max
reference clock input - SMA on back panel    
reference clock input impedance - 50 Ω, AC coupled    
reference clock input frequency - 10 / 100 MHz    
reference clock input amplitude 10 MHz -4 dBm - +13 dBm
  100 MHz –5 dBm - +13 dBm
reference clock output - SMA on back panel    
reference clock output impedance 50 Ω, AC coupled    
reference clock output amplitude into 50 Ω 2 Vpp - 5 Vpp
reference clock output frequency 10/100 MHz    
reference clock output jitter derived from integrated phase noise measurement (12 kHz to 20 MHz offset frequency) - 280 fs RMS -
Table 10: Oscillator and Clocks
Parameter Details Min Typ Max
internal clock type - OCXO    
internal clock long term accuracy / aging - - - ±0.3 ppm/year
internal clock short term stability (1 s) - - - ±0.05 ppm
internal clock initial accuracy - - - ±0.5 ppm
internal clock temperature stability –20°C to 70°C - - ±0.5 ppm
internal clock phase noise offset 100 Hz - –135 dBc/Hz -
  offset 1 kHz - –157 dBc/Hz -

Digital Interface Specifications

Table 11: Digital Interfaces
Parameter Description
host computer connection USB 3.0, 1.6 Gbit/s (1 communication, 1 maintenance)
  1GbE, LAN / Ethernet, 1 Gbit/s
DIO port 4 x 8 bit, general purpose digital input/output port, 3.3 V TTL specification
ZSync peripheral port connector for ZI proprietary bus to communicate with external peripherals (2 times)

DIO Port

The DIO port is a VHDCI 68 pin connector as introduced by the SPI-3 document of the SCSI-3 specification. It is a female connector that requires a 32 mm wide male connector. The interface standard is switchable between LVDS (low-voltage differential signalling) and LVCMOS/LVTTL. The DIO port features 32 user-controlled bits that can all be configured byte-wise as inputs or outputs in LVCMOS/LVTTL mode, whereas in LVDS mode, half of the bits are always configured as inputs. For more specifics on how the user-definable pins can be set.

Figure 1: DIO HD 68 pin connector

Table 12: Electrical Specifications
Parameter Details Min Typ Max
supported DIO interface standards - LVCMOS/LVTTL (single-ended, 3.3 V); LVDS (differential)    
high-level input voltage VIH LVCMOS/LVTTL 2.0 V - -
low-level input voltage VIL LVCMOS/LVTTL - - 0.8 V
high-level output voltage VOH LVCMOS/LVTTL
at IOH < 12 mA
2.6 V - -
low-level output voltage VOL LVCMOS/LVTTL
at IOL < 12 mA
- - 0.4 V
high-level output current IOH (sourcing) LVCMOS/LVTTL - - 12 mA
low-level output current IOL (sinking) LVCMOS/LVTTL - - 12 mA
input differential voltage VID LVDS 100 mV - 600 mV
input common-mode voltage VICM LVDS 0.3 V - 2.35 V
output differential voltage VOD LVDS 247 mV - 454 mV
output common-mode voltage VOCM LVDS 1.125 V - 1.375 V
Table 13: DIO Pin Assignment in LVCMOS/LVTTL Mode
Pin Name Description
68 CLKI digital input
67 unused leave unconnected
66 .. 59 DIO[31:24] digital input or output byte (set by user)
58 .. 51 DIO[23:16] digital input or output byte (set by user)
50 .. 43 DIO[15:8] digital input or output byte (set by user)
42 .. 35 DIO[7:0] digital input or output byte (set by user)
34 GND digital ground
33 unused leave unconnected
32 .. 1 GND digital ground
Table 14: DIO Pin Assignment in LVDS Mode
Pin Name Description
68 CLKI+ digital input
67 unused leave unconnected
66 .. 59 DI+[31:24] digital input byte
58 .. 51 DI+[23:16] digital input byte
50 .. 43 DIO+[15:8] digital input or output byte (set by user)
42 .. 35 DIO+[7:0] digital input or output byte (set by user)
34 CLKI– digital input
33 unused leave unconnected
32 .. 25 DI–[31:24] digital input byte
24 .. 17 DI–[23:16] digital input byte
16 .. 9 DIO–[15:8] digital input or output byte (set by user)
8 .. 1 DIO–[7:0] digital input or output byte (set by user)